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Electronic new competition PCB needs warming
Add Time:2021/2/23 10:54:21

 Electronics industry will benefit in the fourth quarter launched WIN8 and Ultarbook price cuts, Apple (APPLE) iPhone5 and iPadmini launched the printed circuit board (PCB) industry stocking needs warming is expected to push up soft board, HDI, and the carrier boardmanufacturers third-quarter operating period, including Unimicron (3037), King Master (3189) and Watertown (2313) related supply chain in the second half is expected to peak season continued prosperous.

Legal person said that, Unimicron the third quarter operating growth momentum will come from the HDI, the U.S. Department of A brand customers will launch a new Smartphone and the TabletPC up the goods force quarter increased 5 percent, 3 percent, is expected to drive the Unimicron HDI shipping strengthened; the performance of the carrier board also continues to rise, this season will be expected to grow 5-10% from the previous quarter.

Corporate estimates, the Unimicron third-quarter revenues of about 18.7 billion yuan, quarter by 13.5 percent, enhance the utilization rate, the gross margin is expected towards the 16% move closer to the third quarter after-tax profit of 1.47 billion yuan, the quarter increased 60.7 %, EPS is expected to challenge the $ 1.

Benefit from the the Qualcomm28 nanometer process and AppleA6, theme; corporate expectations, the Kinsus the second half of the gross margin is expected to continued stability in more than 34%.

It is understood that Kinsus actively adjust the product mix, driven by higher gross profit FC-BT/FC-ABF proportion of revenues to increase, coupled with the AppleA6 if production shipments, support Kinsus to maintain a high gross margin in the second half of the main reasons.

Market rumors, Apple iPhone5 phone in advance may be available to late August, driven by the related components factory in July operating active, as the Apple HDI supply chain, Chinese, came at the same time received orders for customers of the two products, including iPadmini and the iPhone5 battery backplane. Hua Tong said that as long as customers launch new products, Huatong will strive to disclose the product project.

China through deep plowing mobile phone with high-density connection (HDI) board decided to overweight, high-end HDI process, future Taiwan Arundo donax plant will be converted to any layer (AnyLayer) HDI, sights, high-end smart phone orders cake. In addition, Huatong will be expanded SMT production lines, is expected to increase 15-20 capacity, the performance in the second half will have a larger growth rate.

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